Hybrid integrated circuits in which passive elements (resistors, capacitors, interconnections, etc.), obtained by thin-or thick-film technology, and active elements (diodes, transistors, monolithic integrated circuits, etc.), obtained by semiconductor technology, are combined to all intents and purposes indivisibly, on a single insulating substrate (glass, ceramic, etc.).
Hibridna integrirana vezja, pri katerih so pasivni elementi (upori, kondenzatorji, vmesne zveze itd.) dobljeni s tankoplastno in debeloplastno tehniko in aktivni elementi (diode, tranzistorji, monolitna integrirana vezja itd.) dobljena s polprevodniško tehnologijo, nedeljivo povezani na eni izolirni podlagi (steklo, keramika itd.).